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The difference and use scope of the PCB immersion gold and gold plating process

In the circuit board production process, the immersion gold and gold plating processes are very common processes.
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Several common packaging methods for electronic components

Component packaging plays a role in mounting, fixing, sealing, protecting chips and enhancing electrothermal performance. In addition, according to the contacts on the chip, the power lines are connected to the pins of the package casing.
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What is the BGA in SMT processing?

The BGA processed by SMT is a packaging method. BGA is the abbreviation of Ball Grid Array in English and translated into ball grid array packaging in Chinese.
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Characteristics and main uses of PCB copper plating and nickel plating

Characteristics and main uses of PCB copper plating and nickel plating introduction, PCB copper plating VS nickel plating
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Top 10 PCB Manufacturers in China in 2019

China is the country with the most PCB exports in 2019. This article will introduce the 10 best circuit board manufacturers in 2019.
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Detailed explanation of high-speed backplane PCB design process

The detailed high-speed backplane design process, in addition to following the IPD (commodity integrated development and design) steps, has a certain uniqueness, which is different from the general hardware configuration PCB control development.
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