PCB Production Process

1

Lamination

2

Inner Dry Film Imaging

3

Inner Etching(Inner Des）

4

Inner Layer Inspection(100%)

5

Brown Oxide

6

Pressing(stack-up)

7

Drilling

8

PTH&VCP

9

Outer Dry Film imaging

10

Pattern Plating

11

Outer Etching(Outer test)

12

Outer Layer Inspection(100%)

13

Solder Mask

14

Component Mark

15

HASL/ENIG/OSP/ETC

16

Profile

17

V-cut

18

E-Test/Fly-probe

19

Final Audit

20

Packing/shipment Audit/Shipment