PCB manufacturing is very complicated process, any mistakes or wrongs in one process may cause the destroy of the board .
So testing is necessary. Here we will see a outgoing Inspection report of a Reliability testing ( based on the rules IPC-TM-650 )
|
Item |
Test method |
Criterion |
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|
S/M |
Adhesion Testing |
260℃±5℃*5sec*3Times, |
Solder mask don't fall off or delamination |
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|
Solvent Testing |
Isopropyl alcohol Immersion 30min |
|
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hardness Testing |
6H Pencil Testing |
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|
Legend |
Adhesion Testing |
3M Adhesive tape Testing |
Legend don't be fall off |
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|
Solvent Testing |
Isopropyl alcohol Immersion 30min |
ink don't change color,delamination or intenerate |
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|
Carbon oil |
Adhesion Testing |
260℃±5℃*5sec*3Times |
the tin and fall off |
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|
Solvent Testing |
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|
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|
peelable S/M Thermal Stress Testing |
260℃±5℃*5sec*3Times |
Not fall off and carbonization |
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|
Gold Adhesion Testing |
3M Adhesive tape Testing |
|
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|
Solderability Testing |
HASL:235℃±5℃*5sec |
95% good solderability |
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|
Thermal Stress Testing |
288℃±5℃*10sec*3Times |
|
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Open-short Testing |
|
100% PASS |
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|
Insulation Resistance Testing |
Insulation Resistance test instrument |
N/A |
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|
High voltage testing |
High voltage test instrument |
N/A |
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|
|
|
≤ |
1.56 |
μg Eq NaCl/Sqcm |
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|
Impedance testing |
|
50+/-10%OHM |
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|
Bow and twist |
Bow |
Plug gauge testing |
|
|
0.70% |
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|
twist |
Plug gauge testing |
|
|
0.70% |
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For different standard the above Data might be different , you can always asks for a report from Stariver group.
