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Reliability Testing of PCB

Release Date:2019-12-06


PCB manufacturing is very complicated process, any mistakes or wrongs in one process may cause the destroy of the board . 

So testing is necessary. Here we will see a outgoing Inspection report of a Reliability testing ( based on the rules IPC-TM-650 )

 

Item

Test method

Criterion

S/M

Adhesion Testing

260℃±5℃*5sec*3Times,
3M Adhesive tape Testing

Solder mask don't fall off or delamination

Solvent Testing

 Isopropyl alcohol Immersion 30min


soldermask don't change color,delamination or intenerate

hardness Testing

6H Pencil Testing


Ink not Scratch

Legend

Adhesion Testing

3M Adhesive tape Testing

Legend don't be fall off

Solvent Testing

Isopropyl alcohol Immersion 30min

ink don't change color,delamination or intenerate

Carbon oil

Adhesion Testing

260℃±5℃*5sec*3Times


Carbon oil do not adhibit on 

the  tin and fall off

Solvent Testing


Isopropyl alcohol marinate for 30min


Ink don't change color,delamination or intenerate

peelable S/M Thermal Stress Testing

260℃±5℃*5sec*3Times

Not fall off and carbonization

Gold Adhesion Testing

3M Adhesive tape Testing


Gold not fall off

Solderability Testing

HASL:235℃±5℃*5sec
Other:255℃±5℃*5sec

95% good solderability

Thermal Stress Testing

288℃±5℃*10sec*3Times


laminate don't fall off or delamination

Open-short Testing

 

100% PASS

Insulation Resistance  Testing

Insulation Resistance test instrument

N/A

High voltage testing

High voltage test instrument

N/A


Ionic contamination testing


Ionic contamination test instrument

1.56

μg Eq NaCl/Sqcm

Impedance testing


Impedance test instrument

50+/-10%OHM

Bow and twist

Bow

Plug gauge testing

 

 

0.70%

twist

Plug gauge testing

 

 

0.70%

 

 

For different standard the above Data might be different , you can always asks for a report from Stariver group.

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