According to the annual association work plan, CPCA and JPCA will jointly hold the "2020 China-Japan Electronic Circuit Autumn Conference and Autumn International PCB Technology/Information Forum" in South China from November 5th to 6th this year. The theme of this forum is "Sophisticated Intelligence "Building the future of Zhilian" is now open to the industry for paper collection.
Invite all units in the industry, especially member units, to pay close attention to the development of the industry and participate in exchanges, actively organize management personnel, engineering and technical personnel to write relevant papers, and actively apply for submissions.
organizer:
China Electronic Circuit Industry Association (CPCA)
Japan Electronic Circuit Industry Association (JPCA)
CPCA Science and Technology Committee
media support:
Printed Circuit Information Magazine, PCB Information Network
Essay scope
(1) Intelligent manufacturing
5G requirements and solutions for PCB products
5G's PCB technical requirements at the terminal
New technologies and materials in the 5G era
Application of intelligent equipment or intelligent production management system
(2) HDI board/ high frequency high speed material/equipment
New PCB processing technology for flexible and rigid flexible boards
New processing technology of HDI board, IC carrier board and embedded component board
Manufacturing process of high-speed high-frequency board
Application market prospect and processing technology of high-speed high-frequency materials
New technology of electronic interconnection device
(3) New technologies for green production
New technologies for waste treatment and recycling
New environmental protection and energy saving process technology
Discussion on Terminal Outlet of Solid Waste Treatment
(4) PCB reliability control
5G reliability manufacturing process
Summary of PCB Product Quality Reliability Research
Research on the reliability of vehicle-mounted system
Failure analysis of PCB
PCB substrate selection and its impact on product reliability
Reliability Research of Metalized Hole
(5) Manufacturing technology of rigid-flex board
(6) New energy technology for automobile panels
(7) PCB market and management
PCB industry and electronic information industry market development trend
Human resources, quality assurance and cost-saving management
Other new concepts and experiences worth implementing
According to the annual association work plan, CPCA and JPCA will jointly hold the "2020 China-Japan Electronic Circuit Autumn Conference and Autumn International PCB Technology/Information Forum" in South China from November 5th to 6th this year. The theme of this forum is "Sophisticated Intelligence "Building the future of Zhilian" is now open to the industry for paper collection.
Invite all units in the industry, especially member units, to pay close attention to the development of the industry and participate in exchanges, actively organize management personnel, engineering and technical personnel to write relevant papers, and actively apply for submissions.
organizer:
China Electronic Circuit Industry Association (CPCA)
Japan Electronic Circuit Industry Association (JPCA)
organizer:
CPCA Science and Technology Committee
media support:
Printed Circuit Information Magazine, PCB Information Network
0
1
Essay scope
(1) Intelligent manufacturing
5G requirements and solutions for PCB products
5G's PCB technical requirements at the terminal
New technologies and materials in the 5G era
Application of intelligent equipment or intelligent production management system
(2) HDI board/high frequency high speed material/equipment
New PCB processing technology for flexible and rigid flexible boards
New processing technology of HDI board, IC carrier board and embedded component board
Manufacturing process of high-speed high-frequency board
Application market prospect and processing technology of high-speed high-frequency materials
New technology of electronic interconnection device
(3) New technologies for green production
New technologies for waste treatment and recycling
New environmental protection and energy saving process technology
Discussion on Terminal Outlet of Solid Waste Treatment
(4) PCB reliability control
5G reliability manufacturing process
Summary of PCB Product Quality Reliability Research
Research on the reliability of vehicle-mounted system
Failure analysis of PCB
PCB substrate selection and its impact on product reliability
Reliability Research of Metalized Hole
(5) Manufacturing technology of rigid-flex board
(6) New energy technology for automobile panels
(7) PCB market and management
PCB industry and electronic information industry market development trend
Human resources, quality assurance and cost-saving management
Other new concepts and experiences worth implementing
According to the annual association work plan, CPCA and JPCA will jointly hold the "2020 China-Japan Electronic Circuit Autumn Conference and Autumn International PCB Technology/Information Forum" in South China from November 5th to 6th this year. The theme of this forum is "Sophisticated Intelligence "Building the future of Zhilian" is now open to the industry for paper collection.
Invite all units in the industry, especially member units, to pay close attention to the development of the industry and participate in exchanges, actively organize management personnel, engineering and technical personnel to write relevant papers, and actively apply for submissions.
organizer:
China Electronic Circuit Industry Association (CPCA)
Japan Electronic Circuit Industry Association (JPCA)
organizer:
CPCA Science and Technology Committee
media support:
Printed Circuit Information Magazine, PCB Information Network
0
1
Essay scope
(1) Intelligent manufacturing
5G requirements and solutions for PCB products
5G's PCB technical requirements at the terminal
New technologies and materials in the 5G era
Application of intelligent equipment or intelligent production management system
(2) HDI board/high frequency high speed material/equipment
New PCB processing technology for flexible and rigid flexible boards
New processing technology of HDI board, IC carrier board and embedded component board
Manufacturing process of high-speed high-frequency board
Application market prospect and processing technology of high-speed high-frequency materials
New technology of electronic interconnection device
(3) New technologies for green production
New technologies for waste treatment and recycling
New environmental protection and energy saving process technology
Discussion on Terminal Outlet of Solid Waste Treatment
(4) PCB reliability control
5G reliability manufacturing process
Summary of PCB Product Quality Reliability Research
Research on the reliability of vehicle-mounted system
Failure analysis of PCB
PCB substrate selection and its impact on product reliability
Reliability Research of Metalized Hole
(5) Manufacturing technology of rigid-flex board
(6) New energy technology for automobile panels
(7) PCB market and management
PCB industry and electronic information industry market development trend
Human resources, quality assurance and cost-saving management
Other new concepts and experiences worth implementing
According to the annual association work plan, CPCA and JPCA will jointly hold the "2020 China-Japan Electronic Circuit Autumn Conference and Autumn International PCB Technology/Information Forum" in South China from November 5th to 6th this year. The theme of this forum is "Sophisticated Intelligence "Building the future of Zhilian" is now open to the industry for paper collection.
Invite all units in the industry, especially member units, to pay close attention to the development of the industry and participate in exchanges, actively organize management personnel, engineering and technical personnel to write relevant papers, and actively apply for submissions.
organizer:
China Electronic Circuit Industry Association (CPCA)
Japan Electronic Circuit Industry Association (JPCA)
organizer:
CPCA Science and Technology Committee
media support:
Printed Circuit Information Magazine, PCB Information Network
0
1
Essay scope
(1) Intelligent manufacturing
5G requirements and solutions for PCB products
5G's PCB technical requirements at the terminal
New technologies and materials in the 5G era
Application of intelligent equipment or intelligent production management system
(2) HDI board/high frequency high speed material/equipment
New PCB processing technology for flexible and rigid flexible boards
New processing technology of HDI board, IC carrier board and embedded component board
Manufacturing process of high-speed high-frequency board
Application market prospect and processing technology of high-speed high-frequency materials
New technology of electronic interconnection device
(3) New technologies for green production
New technologies for waste treatment and recycling
New environmental protection and energy saving process technology
Discussion on Terminal Outlet of Solid Waste Treatment
(4) PCB reliability control
5G reliability manufacturing process
Summary of PCB Product Quality Reliability Research
Research on the reliability of vehicle-mounted system
Failure analysis of PCB
PCB substrate selection and its impact on product reliability
Reliability Research of Metalized Hole
(5) Manufacturing technology of rigid-flex board
(6) New energy technology for automobile panels
(7) PCB market and management
PCB industry and electronic information industry market development trend
Human resources, quality assurance and cost-saving management
Other new concepts and experiences worth implementing
According to the annual association work plan, CPCA and JPCA will jointly hold the "2020 China-Japan Electronic Circuit Autumn Conference and Autumn International PCB Technology/Information Forum" in South China from November 5th to 6th this year. The theme of this forum is "Sophisticated Intelligence "Building the future of Zhilian" is now open to the industry for paper collection.
Invite all units in the industry, especially member units, to pay close attention to the development of the industry and participate in exchanges, actively organize management personnel, engineering and technical personnel to write relevant papers, and actively apply for submissions.
organizer:
China Electronic Circuit Industry Association (CPCA)
Japan Electronic Circuit Industry Association (JPCA)
organizer:
CPCA Science and Technology Committee
media support:
Printed Circuit Information Magazine, PCB Information Network
0
1
Essay scope
(1) Intelligent manufacturing
5G requirements and solutions for PCB products
5G's PCB technical requirements at the terminal
New technologies and materials in the 5G era
Application of intelligent equipment or intelligent production management system
(2) HDI board/high frequency high speed material/equipment
New PCB processing technology for flexible and rigid flexible boards
New processing technology of HDI board, IC carrier board and embedded component board
Manufacturing process of high-speed high-frequency board
Application market prospect and processing technology of high-speed high-frequency materials
New technology of electronic interconnection device
(3) New technologies for green production
New technologies for waste treatment and recycling
New environmental protection and energy saving process technology
Discussion on Terminal Outlet of Solid Waste Treatment
(4) PCB reliability control
5G reliability manufacturing process
Summary of PCB Product Quality Reliability Research
Research on the reliability of vehicle-mounted system
Failure analysis of PCB
PCB substrate selection and its impact on product reliability
Reliability Research of Metalized Hole
(5) Manufacturing technology of rigid-flex board
(6) New energy technology for automobile panels
(7) PCB market and management
PCB industry and electronic information industry market development trend
Human resources, quality assurance and cost-saving management
Other new concepts and experiences worth implementing