Regardless of rigid PCBs, flexible PCBs, rigid-flex circuit boards, and module substrates used for IC packaging substrates, PCB products have made great contributions to high-end electronic equipment. The PCB industry occupies an important position in electronic interconnection technology.
Recalling the difficult course of China's PCB after fifty years, today it has written a glorious page in the history of PCB development in the world. In 2006, China's PCB output value was nearly 13 billion US dollars, and it was called the world's largest PCB producer.
On the current development trend of PCB technology:
1. Develop along the path of high-density interconnection technology (HDI)
Since HDI embodies the most advanced technology of contemporary PCB, it brings fine wiring and small aperture to PCB. Among HDI multi-layer board application terminal electronic products-mobile phones (cell phones) is a model of HDI's cutting-edge development technology. In mobile phones, the fine wires of the PCB main board (50μm～75μm/50μm～75μm, wire width/spacing) have become the mainstream, in addition, the conductive layer and the thickness of the board are thin; the conductive pattern is miniaturized, which brings high density and high performance of electronic equipment .
2. The component embedding technology has strong vitality
Semiconductor devices (called active components), electronic components (called passive components) or passive components have been formed on the inner layer of the PCB. The "component embedded PCB" has been mass-produced. Great changes, but the development must solve the analog design method, production technology and inspection quality, reliability assurance is the top priority. We must increase the investment of resources in systems including design, equipment, testing and simulation to maintain strong vitality.
3. The material development in PCB should be improved
Whether it is rigid PCB or flexible PCB material, as global electronic products are lead-free, these materials must be made more heat resistant, so new high Tg, small thermal expansion coefficient, small dielectric constant, and excellent dielectric loss tangent material keep appearing.
4. The photoelectric PCB has a bright future
It uses the optical path layer and the circuit layer to transmit signals. The key of this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer formed by lithography, laser ablation, reactive ion etching and other methods. At present, the technology has been industrialized in Japan and the United States.
5. The manufacturing process should be updated and advanced equipment should be introduced
1. Manufacturing process HDI manufacturing has matured and tended to be perfect. With the development of PCB technology, although the commonly used subtractive manufacturing methods still dominate in the past, low-cost processes such as additive and semi-additive methods have begun to emerge.
Using nanotechnology to metalize holes and form PCB conductive patterns at the same time, a new manufacturing method for flexible boards.
High reliability, high quality printing method, inkjet PCB process.
2. Advanced equipment Production of fine wires, new high-resolution photomasks and exposure devices, and laser direct exposure devices. Production components embedded (passive active components) manufacturing and installation equipment and facilities.
