CCL Development History
Copper clad laminate is the basic material for manufacturing PCB. The technology and production of Copper-clad laminate (Copper-2lad I, CCI) have been developed for half a century, and the annual output of the world has reached 290 million square meters. This development is constantly being innovatively developed by electronic machine products, semiconductor manufacturing technology, electronic installation technology, and printed circuit board technology. Driven by.
Since the copper clad laminates made of phenolic resin substrates began to be practical in 1943, the development of substrate materials has been very rapid. In 1959, Texas Instruments produced the first integrated circuit, which put forward higher high-density assembly requirements for printed boards, which further promoted the production of multilayer boards. In 1961, Hazeltine Corporation of the United States successfully developed the multi-layer board technology using the metallized via process. In 1977, BT resin realized industrial production, and provided a new type of substrate material with high and low Tg for the development of multi-layer board in the world.
In 1990, IBM Corporation of Japan announced the new technology of multi-layer board using photosensitive resin as the insulating layer. In 1997, the technology of high-density interconnected multi-layer board including laminated multi-layer board moved to a mature stage. At the same time, the plastic packaging substrates typically represented by BGA and CSP have developed rapidly. In the late 1990s, some new types of substrates, such as green flame retardants that did not contain bromine or antimony, quickly emerged and entered the market.After more than 40 years of development, my country's substrate material industry has formed a production scale with an annual output value of about 9 billion yuan. In 2000, the total output of my country's mainland CCL has reached 64 million square meters, creating an output value of 5.5 billion yuan. Among them, the output of paper-based CCL has ranked third in the world. However, there is still a considerable gap with the advanced foreign countries in terms of technological level, product variety, and especially the development of new substrates.
Classification of CCL
General CCL for printed boards can be divided into two categories: rigid CCL and flexible CCL. An important variety of general rigid substrate materials is copper clad laminate.
It is made of reinforced material (Reinforeing Material), impregnated with resin adhesive, dried, cut and laminated into blanks, then covered with copper foil, using steel plate as a mold, and processed by high temperature and high pressure forming in a hot press Made. The general prepregs for multilayer boards are semi-finished products in the production process of copper clad laminates (mostly glass cloths are impregnated with resin and dried to process).
There are various classification methods for copper clad laminates. In general, according to the different reinforcement materials of the board, it can be divided into five categories: paper base, glass fiber cloth base, composite base (CEM series), laminated multi-layer board base and special material base (ceramic, metal core base, etc.). If it is classified according to the different resin adhesives used in the board, the common paper-based CCI. There are various types of phenolic resin (XPc, XxxPC, FR-1, FR-2, etc.), epoxy resin (FE-3), polyester resin and so on. Common glass fiber cloth base CCL has epoxy resin (FR-4, FR-5), it is the most widely used type of glass fiber cloth base. In addition, there are other special resins (using glass fiber cloth, polyamide fiber, non-woven fabric, etc. as additional materials): bismaleimide modified triazine resin (BT), polyimide resin (PI) , Diphenylene ether resin (PPO), maleic anhydride imide-styrene resin (MS), polycyanate resin, polyolefin resin, etc.
According to the classification of CCL's flame retardant performance, it can be divided into flame retardant type (UL94-VO, UL94-V1 level) and non-flame retardant type (UL94-HB level). As more attention is paid to environmental protection issues, a new type of CCL without bromine is classified in the flame retardant CCL, which can be called "green flame retardant cCL". With the rapid development of electronic product technology, there are higher performance requirements for cCL. Therefore, from the performance classification of CCL, it is divided into general performance CCL, low dielectric constant CCL, high heat resistance CCL (general board L is above 150 ℃), low thermal expansion coefficient CCL (generally used on packaging substrates ) And other types.