However, in the future, because of the increasing labor costs, many PCB circuit board companies in Shenzhen will go to the mainland and cheap places, leaving only circuit board sales customers and marketing and circuit board R & D centers in Shenzhen.
Looking forward to 2020, the global PCB industry will continue to grow. With the vigorous development of new applications such as 5G, automotive, Internet of Things, and artificial intelligence, more market opportunities and challenges are ushered in. Among them, high-frequency PCBs are rigid needs, and the key to achieving high-frequency PCBs The high-frequency copper-clad laminate materials (such as polytetrafluoroethylene (PTFE), hydrocarbon (Hydrocarbon), etc. and PCB manufacturers' own processes. The challenge of the PCB industry is the tightening of raw material supply and the increasingly strict environmental protection policies, making the PCB industry The threshold has gradually increased and the industry concentration is gradually expanding.
In the current development of PCB technology, in addition to mass production of new processes and thin circuit technologies, large manufacturers have developed high-end Micro-LED PCB processes and high-frequency high-speed HDI product technologies, and in the field of carrier boards, they have invested in packaging carrier boards for high-frequency Internet applications. , Ultra-thin circuit package carrier technology, and thin, double-in high-density ultra-fine circuit Coreless package carrier technology, in order to accelerate the development of 5G, IoT and AI, and accelerate the packaging of related products and in-line components technology.
Observing the overall industry development trend, the global PCB industry is moving towards high density, high precision and high reliability, continuously reducing costs, improving performance, reducing volume, increasing productivity and reducing environmental impact, in order to adapt to the development of downstream electronic terminal equipment industries, including HDI (High Density Interconnect), FPC (Flexible Printed Circuit), rigid-flex combination board and IC carrier board will become the focus of future development.