The vigorous development of 5G communication and the high growth of the server industry are driving the demand for communication boards.
According to Prismark statistics, the PCB market size of the downstream communication industry in 2018 was 11.692 billion US dollars, and it will reach 13.747 billion US dollars in 2022, with a compound annual growth rate of 6.2% from 2017 to 2022. We estimate the segmentation of wireless base stations. In 2019, the global PCB market for 5G wireless base station construction will be approximately 13.365 billion yuan, and will reach a peak of 45.163 billion yuan in 2022. The explosive growth of the server market in 2018 has driven demand for high-level boards. In the future, 5G construction will further expand server demand and promote server product upgrades. The server PCB market is expected to continue to expand. The communication board business manufacturers have considerable revenue in the next 2-5 years. It is recommended to focus on Teng Chuangda circuits involved in 5G base stations and terminals, Shengyi Technology, Shennan Circuit, Hudian and Chongda Technology.Automobile electrification and intelligence bring new growth space to the automotive PCB market.
The output value of automotive PCBs in 2018 is US $ 7.6 billion, and the global automotive PCB output value is expected to reach US $ 10.171 billion in 2023, with a CAAGR of 6%. It is estimated that in 2023, the PCB output of traditional fuel vehicles will drop to 4.149 billion US dollars, CAAGR is -5%; the new PCB output value of automotive electrification is 5.437 billion US dollars, CAAGR is as high as 23.61%; 100 million US dollars, CAAGR is 10.54%. The threshold for the production of safety auto plates is higher, the domestic market is less competitive, and manufacturers have huge room for profit in the future. It is recommended to pay attention to Shanghai Electric Power Co., Ltd., a leader in traditional automotive safety control electronics, and Shennan Circuit, which has already realized the supply of motor control systems for new energy vehicles.In recent years, consumer electronics has continued to innovate, creating new growth space for consumer electronics PCBs.
According to Prismark statistics, the PCB production value for consumer electronics in 2018 was 24.171 billion US dollars, and it is expected to reach 28.87 billion US dollars in 2022, with a CAAGR of 4.2%. In the segmented field, the smart wearable device market is experiencing explosive growth, with shipments of 135 million units in 2018, 205 million units in 2023, and a CAAGR of 23% in 2018-2023, driving FPC demand growth. 5G will also become a new growth point for smart phones. It is expected that shipments of 5G phones will reach 725 million units in 2023, driving demand for high-end PCBs such as SLP and high-end HDI. With FPC as the main business, manufacturers with SLP and high-end HDI production capacity will usher in new revenue. It is recommended to focus on domestic FPC leaders and Pengding Holdings with SLP mass production capabilities, domestic FPC major Dongshan Precision and Zhongjing Electronics with potential small batch high-end HDI mass production capabilities.China currently focuses on low-end and mid-range products, and is expected to achieve domestic substitution in the high-end product market. High-end PCB product manufacturers have good prospects for future development.
The global high-end PCB product market is dominated by overseas companies, but due to trade frictions and strong demand for Chinese independent electronic brands, the market prospects of China's high-end PCB manufacturers are promising. By broadening financing channels, increasing production R & D investment, and continuously expanding production capacity, domestic leading PCB companies will continue to increase their market share in the global high-end PCB products. It is recommended to focus on domestic FPC leaders, Peng Ding Holdings with SLP mass production capability, and Zhongjing Electronics with potential small batch high-end HDI mass production capability, Shennan Circuit, Chongda Technology and Xingsen Technology with mass production capability of packaging substrates.
Tengchuangda Circuit has more than 850 employees and a total of two major production bases. The production factories are located in Baoan, Shenzhen and Xinfeng County, Jiangxi. The factory area in Shenzhen is 8,000 square meters and the factory in Jiangxi is 45,000 square meters. The Shenzhen factory is mainly based on sample shipments. Mainly high-volume batch boards and HDI boards, with a monthly production capacity of 50,000 square meters. The company is mainly created by a group of experts in the road board industry. We advocate technological innovation, give full play to the leading role of new technologies in business operations, meet the various needs of customers as their own responsibility, and provide customers with printing Support and service of board related technologies.
Our products include: multilayer board, impedance board, high frequency board, high TG thick copper foil board, buried blind hole board, aluminum substrate, mixed dielectric board, HDI, rigid-flex board, special substrate and customized various specific requirements Printed circuit board. The company has the technology to produce 32-layer board, the board thickness and aperture ratio can be up to 26: 1, the maximum board thickness is 7.0mm, the maximum copper thickness is 15OZ, the minimum mechanical drilling is 0.10mm, the minimum laser drilling is 3mil, and the minimum line width / spacing: 2.0 / 2.0mil. The company has mature HDI board second-order / third-order and multi-layer arbitrary interconnection production technology; for thick plates, thick copper plates, mixed voltage plates, high-frequency plates, high TG plates, high-precision impedance control boards, backplanes, buried capacitance buried resistance boards Etc. have rich production experience.
