In everyone's knowledge, you must know the SMD light source. In fact, the COB light source we are talking about is an upgraded version of the SMD light source. Then you may ask, which ones have been upgraded. The following editor will tell you what is a cob light source, SMD. The difference between light source and COB light source.
The COB light source means that the chip is directly packaged on the entire substrate, that is, the N chips are integrated and integrated on the inner substrate for packaging. It is mainly used to solve the problem of manufacturing high-power LED lamps with low-power chips, which can dissipate chip heat dissipation, improve light efficiency, and improve the glare effect of LED lamps. COB has a high luminous flux density, low glare and soft light, and it emits a uniformly distributed light surface.
The COB light source is a high-efficiency integrated surface light source technology in which the LED chip is directly pasted on a mirror metal substrate with high reflectivity. This technology eliminates the concept of a bracket, no electroplating, no reflow soldering, and no patch process, so the process is reduced by nearly three minutes. One, the cost has also been saved by a third.
The COB light source can be simply understood as a high-power integrated surface light source, and the light emitting area and size of the light source can be designed according to the product's external structure.
Electrical stability, circuit design, optical design, and thermal design are scientific and reasonable;The heat sink process technology is adopted to ensure that the LED has an industry-leading heat lumen maintenance rate (95%).
Facilitate the secondary optical matching of the product and improve the lighting quality.
High color rendering, uniform light emission, no light spots, health and environmental protection.
Simple installation, easy to use, reducing the difficulty of designing the lamp, saving the cost of lamp processing and subsequent maintenance.
SMD LED is the meaning of surface-mounted light-emitting diodes. SMD patches help improve production efficiency and applications in different facilities. It is a solid-state semiconductor device that can directly convert electricity into light. Its voltage is 1.9-3.2V, and the red and yellow voltages are the lowest. The heart of the LED is a semiconductor wafer. One end of the wafer is attached to a bracket, one end is the negative electrode, and the other end is connected to the positive electrode of the power supply. Encapsulated in epoxy resin. A semiconductor wafer is composed of two parts, one is a P-type semiconductor, in which holes dominate, and the other is an N-type semiconductor, which is mainly electrons. But when these two semiconductors are connected, a P-N junction is formed between them. When a current is applied to the wafer through a wire, electrons are pushed to the P region, where the electrons and holes recombine, and then energy is emitted in the form of photons. This is the principle of LED light emission. The wavelength of light, which is the color of light, is determined by the material that forms the P-N junction.
The traditional LED: "LED discrete components → MCPCB light source module → LED lamps" is mainly due to the lack of suitable core light source components, which is not only time-consuming and costly.
COB package "COB light source module → LED lamp", which can directly package multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, saving the cost of primary packaging of LEDs, manufacturing costs of light engine modules and secondary distribution . In terms of performance, through reasonable design and micro-lens molding, the COB light source module can effectively avoid the disadvantages of point light and glare in the combination of discrete light source devices; it can also add appropriate red chip combinations without significantly reducing the efficiency of the light source and Under the premise of life, effectively improve the color rendering of the light source.
Production efficiency advantage
The production process of COB packaging is basically the same as the traditional SMD production process. The efficiency of SMD packaging is basically the same in the die bonding and wire bonding processes. However, the efficiency of COB packaging in dispensing, separation, beam splitting, and packaging is better than SMD Products are much higher. Traditional SMD packaging labor and manufacturing costs account for about 15% of material costs, and COB packaging labor and manufacturing costs account for about 10% of material costs. With COB packaging, labor and manufacturing costs can be saved by 5%.
