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The manufacturing process of single-sided, double-sided, and multilayer PCB board

Release Date:2020-03-13

This paper mainly introduces: single-sided circuit board, double-sided board HASL board, double-sided board plating gold, multilayer board tin ENIG board, multilayer board plating gold, multilayer board ; the different process of these kinds ofcircuit boards are introduced in detail.


1. Single board  process flow


Blanking and edge grinding→drilling→outer figure→(full plate gold plating)→etching→inspection→silk screen welding resistance→(hot air leveling)→silk screen characters→contour processing→test→inspection.


2. Process flow of HASL for double-sided board


Blanking and edge grinding→drilling→copper sinking and thickening→outer layer figure→tin plating, etching and tin stripping→secondary drilling→inspection→silk screen welding resistance→gold plating plug→hot air leveling→silk screen characters→shape processing→test→inspection.


3. Process flow of  plating gold on double-sided  board


Blanking and edge grinding→drilling→copper sinking and thickening→outer layer figure→nickel plating and gold film removal and etching→secondary drilling→inspection→silk screen welding resistance→silk screen character→shape processing→test→inspection.


4. Process flow of HASL for multilayer board


Blanking and edge grinding→drilling positioning hole→inner layer figure→inner layer etching→inspection→blackening→laminating→drilling→copper sinking and thickening→outer layer figure→tin plating, etching and tin stripping→secondary drilling→inspection→silk screen welding resistance→gold plating plug→hot air leveling→silk screen character→shape processing→test→inspection.


5. Process flow of nickel plating gold on multilayer board


Blanking and edge grinding→drilling positioning hole→inner layer figure→inner layer etching→inspection→blackening→laminating→drilling→copper sinking and thickening→outer layer figure→gold plating and film removal etching→secondary drilling→inspection→silk screen welding resistance→silk screen character→shape processing→test→inspection.


6. Process flow of multilayer ENIG board


Blanking and edge grinding→drilling positioning hole→inner layer figure→inner layer etching→inspection→blackening→laminating→drilling→copper sinking and thickening→outer layer figure→tin plating, etching and tin stripping→secondary drilling→inspection→silk screen resistance welding→chemical nickel deposition→silk screen character→shape processing→test→inspection.

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