This paper mainly introduces: single-sided circuit board, double-sided board HASL board, double-sided board plating gold, multilayer board tin ENIG board, multilayer board plating gold, multilayer board ; the different process of these kinds ofcircuit boards are introduced in detail.
1. Single board process flow
Blanking and edge grinding→drilling→outer figure→(full plate gold plating)→etching→inspection→silk screen welding resistance→(hot air leveling)→silk screen characters→contour processing→test→inspection.
2. Process flow of HASL for double-sided board
Blanking and edge grinding→drilling→copper sinking and thickening→outer layer figure→tin plating, etching and tin stripping→secondary drilling→inspection→silk screen welding resistance→gold plating plug→hot air leveling→silk screen characters→shape processing→test→inspection.
3. Process flow of plating gold on double-sided board
Blanking and edge grinding→drilling→copper sinking and thickening→outer layer figure→nickel plating and gold film removal and etching→secondary drilling→inspection→silk screen welding resistance→silk screen character→shape processing→test→inspection.
4. Process flow of HASL for multilayer board
Blanking and edge grinding→drilling positioning hole→inner layer figure→inner layer etching→inspection→blackening→laminating→drilling→copper sinking and thickening→outer layer figure→tin plating, etching and tin stripping→secondary drilling→inspection→silk screen welding resistance→gold plating plug→hot air leveling→silk screen character→shape processing→test→inspection.
5. Process flow of nickel plating gold on multilayer board
Blanking and edge grinding→drilling positioning hole→inner layer figure→inner layer etching→inspection→blackening→laminating→drilling→copper sinking and thickening→outer layer figure→gold plating and film removal etching→secondary drilling→inspection→silk screen welding resistance→silk screen character→shape processing→test→inspection.
6. Process flow of multilayer ENIG board
Blanking and edge grinding→drilling positioning hole→inner layer figure→inner layer etching→inspection→blackening→laminating→drilling→copper sinking and thickening→outer layer figure→tin plating, etching and tin stripping→secondary drilling→inspection→silk screen resistance welding→chemical nickel deposition→silk screen character→shape processing→test→inspection.
