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Common methods for testing after SMT processing

Release Date:2020-03-12

The process flow of SMT chip processing is complicated and tedious, and problems may occur in each link. In order to ensure the quality of products, various testing equipment is needed to detect faults and defects and solve problems in a timely manner. So what are the common detection equipment in SMT chip processing? What is its function? Today we will introduce it for everyone.

1.MVI (manual visual inspection)

2.AOI detection equipment

(1) Where AOI inspection equipment is used: AOI can be used in multiple locations on the production line, and each location can detect special defects, but the AOI inspection equipment should be placed in a location that can identify and correct the most defects as soon as possible.
(2) Defects that can be detected by AOI: AOI is generally inspected after the PCB board etching process, and is mainly used to find the missing and redundant parts.

3.X-RAY detector

(1) Where the X-RAY detector is used: It can detect all solder joints on the circuit board, including solder joints that are not visible to the naked eye, such as BGA.
(2) Defects that can be detected by the X-RAY detector: Defects that can be detected by the X-RAY detector mainly include defects such as bridging after welding, voids, too large solder joints, and too small solder joints.

4.ICT testing equipment

(1) Where ICT is used: ICT is oriented to production process control and can measure resistance, capacitance, inductance, and integrated circuits. It is particularly effective for detecting open circuits, short circuits, and component damage, with accurate fault location and easy maintenance.
(2) Defects that can be detected by ICT: It can test problems such as soldering, open circuit, short circuit, component failure, and wrong materials after welding.
About the commonly used testing equipment and functions of SMT chip processing, I will introduce here today. The quality assurance of SMT chip processing, in addition to using these testing equipment, is also inseparable from the strict quality management monitoring of chip processing manufacturers. Jingbang Technology's professional chip processing manufacturers strictly control each link of production, set up nine testing procedures, from IQC incoming inspection → SPI solder paste inspection → online AOI inspection → SMT first article inspection → IPQC product inspection → offline AOI Inspection → X-RAY-welding inspection → QC manual inspection → QA shipment inspection to ensure zero defect products and provide customers with excellent quality services.
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